Raise3D Hyper Speed ABS V2 Filament

  • Item Id 29958
  • Variation ID 12156
  • EAN 6942267300155
  • Mfg part No, [S]5.11.19068A01

Hyper Speed ABS filament is specifically designed to be used with the Hyper FFF® solution from the Hyper Speed filament line. When printing at high speeds, the regular ABS filament is rapidly fed into the heat block, and the polymer has very little time to go from a solid to a molten state, which can cause nozzle clogging and poor bonding quality between layers. Additionally, the regular ABS filament can be subject to warpage and delamination of the printed part during high-speed printing without a heated chamber.


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44,90
 
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Product description

Hyper Speed ABS Filament

Hyper Speed ABS filament is specifically designed to be used with the Hyper FFF® solution from the Hyper Speed filament line. When printing at high speeds, the regular ABS filament is rapidly fed into the heat block, and the polymer has very little time to go from a solid to a molten state, which can cause nozzle clogging and poor bonding quality between layers. Additionally, the regular ABS filament can be subject to warpage and delamination of the printed part during high-speed printing without a heated chamber.

With optimized molecular weight and stiffness, Hyper Speed ABS filament is capable of printing at the speed of up to 300 mm/s thanks to its faster melting and homogenous cooling, which results in a lower temperature gradient and lower inner stress of printed part. Hyper Speed ABS filament exhibits superior heat resistance compared to Hyper Speed ABS filament. With almost no warpage and improved interlayer bonding, Hyper Speed ABS filament is also perfectly suitable for many functional prototyping parts, tools and fittings with many different possibilities for post-processing and finishing methods (e.g., polishing and acetone vapor smoothing).

Note: The current version is Raise3D Hyper Speed ABS V2, and is updated from the previous version.

Characteristics

  • High Speed FFF printing
  • Warp-free parts
  • Improved interlayer bonding
  • Heat resistance up to 77°C (HDT@0.45 MPa)
  • Excellent impact resistance
  • Higher dimensional stability
  • Ready for polishing and acetone vapor smoothing
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